Applications of Nanofluids in Cooling of Electronic Components

Hussein M. Maghrabie, Khaled Elsaid, Tabbi Wilberforce, Enas T. Sayed, Mohammad A. Abdelkareem, Abdul Ghani Olabi

Research output: Chapter in Book/Published conference outputChapter


Enhancing information technology requires sufficient heat removal from electronic devices. This article attempts to investigate experimentally and numerically new procedures to avoid hot spots as well as to manage the thermal load. To maintain these critical requirements, it is necessary to minimize the size of the electronic components and utilize specified working fluids rather than traditional ones. Utilizing nanofluid that is an innovative heat-transfer fluid is a promising solution for cooling electronic components. The enhancement of thermal performance in electronic components using different nanofluids is studied. The nanofluids characteristics and their thermophysical properties; heat transfer augmentation system using nanofluids; various limitations, challenges in applying the nanofluids for electronic components and conclusions and recommendations are presented.

Original languageEnglish
Title of host publicationEncyclopedia of Smart Materials
Subtitle of host publicationThermal, Electrochemical and Electronic Materials
Number of pages9
ISBN (Electronic)9780128157336
ISBN (Print)9780128157329
Publication statusPublished - 2022


  • Electronic components
  • Nanofluids
  • Nanoparticles
  • Thermal Performance


Dive into the research topics of 'Applications of Nanofluids in Cooling of Electronic Components'. Together they form a unique fingerprint.

Cite this