Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

H. Chen; W. Cao; Z. Tan; P. Bordignon; R. Yi; H. Zhang

doi:10.1049/cp.2016.0225

Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

H. Chen, W. Cao, Z. Tan, P. Bordignon, R. Yi, H. Zhang

College of Engineering and Physical Sciences

Research output: Chapter in Book/Published conference output › Conference publication

Abstract

For the Modular Multilevel Converter (MMC) based VSC HVDC, typical topology of its submodules is a half bridge circuit and plastic module IGBTs (PMIs) are common power devices for a submodule. However, PMIs have a relatively short lifetime and open-circuit failure mode, which make them less suitable for power systems. On the other hand, press-pack IGBT/IEGT (PPIs) can offer a much longer lifetime, the unique short-circuit failure mode (SCFM), and higher current carrying capabilities. Hence, PPIs are perfect device for MMC HVDC, especially for future higher rating systems. The ±160kV/200MW MMC converter is the largest one in the Nan'ao multi-terminal VSC HVDC system, and it is also the world's first MMC that is based on single-level PPI devices. This paper will look into detailed hardware design of this MMC converter from device to valve, it will also provide key testing results of submodules.

Original language	English
Title of host publication	8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016), 2016
Publisher	IET
Number of pages	6
ISBN (Print)	978-1-78561-188-9
DOIs	https://doi.org/10.1049/cp.2016.0225
Publication status	Published - 10 Nov 2016
Event	8th IET International Conference on Power Electronics, Machines and Drives - Glasgow, United Kingdom Duration: 19 Apr 2016 → 21 Apr 2016

Conference

Conference	8th IET International Conference on Power Electronics, Machines and Drives
Abbreviated title	PEMD 2016
Country/Territory	United Kingdom
City	Glasgow
Period	19/04/16 → 21/04/16

Bibliographical note

-

Keywords

modular multilevel converter
offshore renewable energy
press-pack IGBT/IEGT
VSC-HVDC

Access to Document

10.1049/cp.2016.0225

Cite this

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title = "Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC",

abstract = "For the Modular Multilevel Converter (MMC) based VSC HVDC, typical topology of its submodules is a half bridge circuit and plastic module IGBTs (PMIs) are common power devices for a submodule. However, PMIs have a relatively short lifetime and open-circuit failure mode, which make them less suitable for power systems. On the other hand, press-pack IGBT/IEGT (PPIs) can offer a much longer lifetime, the unique short-circuit failure mode (SCFM), and higher current carrying capabilities. Hence, PPIs are perfect device for MMC HVDC, especially for future higher rating systems. The ±160kV/200MW MMC converter is the largest one in the Nan'ao multi-terminal VSC HVDC system, and it is also the world's first MMC that is based on single-level PPI devices. This paper will look into detailed hardware design of this MMC converter from device to valve, it will also provide key testing results of submodules.",

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author = "H. Chen and W. Cao and Z. Tan and P. Bordignon and R. Yi and H. Zhang",

note = "-; 8th IET International Conference on Power Electronics, Machines and Drives, PEMD 2016 ; Conference date: 19-04-2016 Through 21-04-2016",

year = "2016",

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doi = "10.1049/cp.2016.0225",

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}

Chen, H, Cao, W, Tan, Z, Bordignon, P, Yi, R & Zhang, H 2016, Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC. in 8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016), 2016. IET, 8th IET International Conference on Power Electronics, Machines and Drives, Glasgow, United Kingdom, 19/04/16. https://doi.org/10.1049/cp.2016.0225

TY - GEN

T1 - Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

AU - Chen, H.

AU - Cao, W.

AU - Tan, Z.

AU - Bordignon, P.

AU - Yi, R.

AU - Zhang, H.

N1 - -

PY - 2016/11/10

Y1 - 2016/11/10

N2 - For the Modular Multilevel Converter (MMC) based VSC HVDC, typical topology of its submodules is a half bridge circuit and plastic module IGBTs (PMIs) are common power devices for a submodule. However, PMIs have a relatively short lifetime and open-circuit failure mode, which make them less suitable for power systems. On the other hand, press-pack IGBT/IEGT (PPIs) can offer a much longer lifetime, the unique short-circuit failure mode (SCFM), and higher current carrying capabilities. Hence, PPIs are perfect device for MMC HVDC, especially for future higher rating systems. The ±160kV/200MW MMC converter is the largest one in the Nan'ao multi-terminal VSC HVDC system, and it is also the world's first MMC that is based on single-level PPI devices. This paper will look into detailed hardware design of this MMC converter from device to valve, it will also provide key testing results of submodules.

AB - For the Modular Multilevel Converter (MMC) based VSC HVDC, typical topology of its submodules is a half bridge circuit and plastic module IGBTs (PMIs) are common power devices for a submodule. However, PMIs have a relatively short lifetime and open-circuit failure mode, which make them less suitable for power systems. On the other hand, press-pack IGBT/IEGT (PPIs) can offer a much longer lifetime, the unique short-circuit failure mode (SCFM), and higher current carrying capabilities. Hence, PPIs are perfect device for MMC HVDC, especially for future higher rating systems. The ±160kV/200MW MMC converter is the largest one in the Nan'ao multi-terminal VSC HVDC system, and it is also the world's first MMC that is based on single-level PPI devices. This paper will look into detailed hardware design of this MMC converter from device to valve, it will also provide key testing results of submodules.

KW - modular multilevel converter

KW - offshore renewable energy

KW - press-pack IGBT/IEGT

KW - VSC-HVDC

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BT - 8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016), 2016

PB - IET

T2 - 8th IET International Conference on Power Electronics, Machines and Drives

Y2 - 19 April 2016 through 21 April 2016

ER -

Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

Abstract

Conference

Bibliographical note

Keywords

Access to Document

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