Abstract
Maintenance plays a significant role in semiconductor manufacturing as plant yield, factory downtime and operation cost are all closely related to maintenance efficiency. Accordingly, maintenance strategies in semiconductor manufacturing industries are increasingly shifting from traditional preventive maintenance (PM) to more efficient predictive maintenance (PdM). PdM uses manufacturing process data to develop predictive models for remaining useful life (RUL) estimation of key equipment components. Traditional approaches to building predictive models for RUL estimation involve manual selection of features from manufacturing process data. This paper proposes to use deep convolutional neural networks (CNN) for the task of estimating RUL of lenses for an ion beam etch tool in semiconductor manufacturing. The proposed approach has the advantage of automatic feature extraction through the use of convolution and pool filters along the temporal dimension of the optical emission spectroscopy (OES) data from the endpoint detection system. Simulation studies demonstrate the feasibility and the effectiveness of the proposed approach.
Original language | English |
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Title of host publication | Electronics, Communications and Networks |
Subtitle of host publication | Proceedings of the 13th International Conference (CECNet 2023), Macao, China, 17–20 November 2023 |
Editors | Antonio J. Tallón-Ballesteros, Estefanía Cortés-Ancos, Diego A. López-García |
Publisher | IOS |
Pages | 68 - 74 |
Volume | 381 |
ISBN (Electronic) | 9781643684819 |
ISBN (Print) | 9781643684802 |
DOIs | |
Publication status | Published - 20 Nov 2023 |
Event | 13th International Conference (CECNet 2023) - Macao, China Duration: 17 Nov 2023 → 20 Nov 2023 |
Publication series
Name | Frontiers in Artificial Intelligence and Applications |
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Publisher | IOS |
Volume | 381 |
Conference
Conference | 13th International Conference (CECNet 2023) |
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Country/Territory | China |
City | Macao |
Period | 17/11/23 → 20/11/23 |
Bibliographical note
© 2024 The authors and IOS Press.This article is published online with Open Access by IOS Press and distributed under the terms
of the Creative Commons Attribution Non-Commercial License 4.0 (CC BY-NC 4.0).